|Other titles||Mass transport in cement-based materials|
|Statement||edited by R. Doug Hooton ... [et al.]|
|Series||Materials science of concrete|
|Contributions||Hooton, R. Douglas, 1952-|
|LC Classifications||TA440 .I66 2001|
|The Physical Object|
|Pagination||viii, 390 p. :|
|Number of Pages||390|
He is interested in constitutive modeling of materials, durability of cement based materials, composites, fracture mechanics, experimental stress analysis, steel structures, and biomechanics. Jan P. Skalny studied chemical engineering at Slovak Technical University (STU) in Bratislava and at the University for Chemical Technology (VSCHT) in. This paper gives the details of the multiionic transport model STADIUM ® intended to describe the degradation of cement-based materials exposed to aggressive environments. The main algorithm is based on an operator splitting approach. The first part of the calculations is dedicated to solving the transport equations without considering the chemical by: Modeling of multi-species ion transport in cement-based materials for radioactive waste container as well as one equation for charge balance and one for the total mass. Ion transport is. Materials Engineering; host publication Materials Science of Concrete, Special Volume: Ion and Mass Transport in Cement-Based Materials pages - publisher American Ceramic Society conference name International Conference on Ion and Mass Transport in Cement-Based Materials conference location Toronto, Canada conference dates
For moisture transport in cement-based materials, the multiphase model can be simplified as a two-phase transport model, just including liquid water and water vapor [11,43]. Assuming the quasi-equilibrium between liquid and vapor during the movement of moisture, the movement of two phases can be combined into one mass balance equation (in 1D form). Journal of Sustainable Cement-Based Materials. The Journal of Cement-Based Materials publishes theoretical and applied researches on materials, products, and structures that incorporate cement. Simulation of chloride ion transport in concrete under wetting–drying cycle. Tongning Cao, Lijuan Zhang, Guowen Sun, Caihui Wang. Abstract. In recent years, with the higher requirements for the performance of cement-based materials and the call for energy conservation and environmental protection, a wave of research on new materials has set off, and various high-performance concrete and more environmentally friendly geopolymers have appeared in the public. D. Cusson, in Failure, Distress and Repair of Concrete Structures, Shrinkage strain (R In cement-based materials, most of the shrinkage occurs when the cement paste dries out after setting and shrinkage is restrained (Fig. b), permanent tensile stresses develop in the repair material and may cause cracking in the material itself, or delamination at the interface.
related to all ions in the pore solution •Increase in temperature •Presence of conductive materials affects the test results •Many transport mechanisms act together 60V DC #20 brass mesh screen. 3% NaCl. N NaOH. Vacuum saturated specimens (mm dia., 50 mm thickness). It is shown that these mass transport effects arise as a result of dead Li accumulation at the Li metal electrode, which introduces a tortuous pathway for Li-ion transport. In Li–Li symmetric cells, mass transport effects cause the shape of the galvanostatic voltage response to change from “peaking” to “arcing”, along with an increase. Chloride ions from the external environment can penetrate into cement-based materials through connected pores. In different circumstances, chloride can be transported into cement-based materials by different mechanisms. When concrete is fully saturated, the transport of chloride in concrete is commonly assumed to be governed by diffusion. Fundamental Aspects of Ion Transport in Solid Electrolytes (S R Narayanan, albeit at a cost of high substrate and packaging mass compared to the mass of active electrode material. The thin film battery components can be fabricated by a wide range of deposition and patterning technologies, most of which are compatible with microelectronic.